Communication module
Communication module
Product introduction

Number of floors: 4 floors, first order


Board thickness: 0.6mm


Size: 128*100.89mm


Sheet: FR4 EM825 Taiwan light


Copper thickness on board surface: ≥35um


Copper thickness in the hole: 20um


Line width and distance: 0.075mm


Minimum aperture: 0.1mm


Surface treatment: Immersion gold≥1u"+OSP


Product use: communication module